Renjuan Lecturer

Department of Mechanical Electronics

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Degree: PhD

Graduate School: University of Birmingham, UK

Email: juan.ren@chd.edu.cn

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The personal data

  • Department: Department of Mechanical Electronics
  • Gender: female
  • BirthDate:
  • Career: Lecturer
  • Degree: PhD
  • Academic Credentials:
  • Graduate School: University of Birmingham, UK
  • Tel:
  • Email: juan.ren@chd.edu.cn
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  • Education experience:

    2000.09-2004.07,Xi'an Jiaotong University,Bachelor

     

    2006.01-2007.03, University of Birmingham, UK,Mechanical Engineering,Master

    supervisor: Professor Kyle Jiang, Professor Remi Olatunbosun

    Thesis: Design of a self powered pressure sensor for tire pressure monitoring system

     

    2007.04-2012.12, University of BirminghamUK,Mechanical Engineering,PhD

    supervisor: Professor Michael Ward, Associate Professor Raya Al AdahThTttThesisThesisThesis

    Thesis: The investment of using micromachined silicon diaphragms in high temperature pressure sensors

    Project Sponsorship: General Electric's Sensing and Testing Technology Department, Leicester, UK


Resume

Social position

Research

-The main direction is' Research on high-precision surface acoustic wave pressure sensors', including sensor structure and process design, finite element simulation and analysis, and sensor performance testing.

Open Course

In the 2017-2021 academic year,  teaching of ‘Academic English 1’ and ‘Academic English 2’ for undergraduate students in the School of Engineering Machinery.

Starting from the 2022 academic year, teaching undergraduate students ‘Testing and Sensor Technology (bilingual)’ and ‘Microcomputer Principles and Interface Technology’.


Research project

From 2021 to 2022, led the collaborative project 'MEMS Resonator' 

Thesis

1.      Jianshu Du, Xueyong Wei, Juan Ren, Zhuangde Jiang, Jiuhong Wang and Ronghua Huan. Micromechanical Vibration Absorber for Frequency Stability Improvement of DETF Oscillator, J. Micromech. Microeng. 29 (2019) 045005

2.      Juan Ren, Kanat Anurakparadorn, Hairong Gu, Minghui Zhao and Xueyong Wei, Design of SAW Sensor for Longitudinal Strain Measurement with Improved Sensitivity, Microsystem Technologies, 25(1), 351-359, 2019.

3.      Juan Ren, Kanat Anurakparadorn, Xueyong Wei, Improving the SAW pressure sensor sensitivity based on finite element modeling, 2016 IEEE International Frequency Control Symposium. 9-12 May 2016, New Orleans, USA.

4.      Juan Ren, Michael Ward, Peter Kinnell, Russell Craddock and Xueyong Wei, Plastic deformation of micromachined silicon diaphragms with a sealed cavity at high temperatures, Sensors, 2016, 16(2), 204. (SCI, EI, 影响因子2.245,一区期刊)

5.      Juan Ren and Mike Ward. The constitutive modeling of high temperature deformation for silicon MEMS diaphragms. Proceeding of 17th Annual Conference of the Chinese Society of Micro-Nano Technology. 11-14 Oct 2015, Shanghai, China.

6.      Xueyong Wei, Lang Nan, Juan Ren, Xiaolong Liu and Zhuangde Jiang, Surface acoustic wave induced thermal lysis of red blood cells in microfluidic channel, 19th International Conference on Miniaturized Systems for Chemistry and Life Sciences (uTAS), 25-29 Oct 2015, Korea.

7.      Jingjing Zhang, Xueyong Wei, Juan Ren, Xiangdong Xue and Zhuangde Jiang, SAW assisted blood/plasma separation in microchannel with constriction-expansion transition, Proceeding of 10th IEEE-NEMS, 7–11 April 2015,  Xi’an, China. (EI)

8.      Tianyi Zhang, Xueyong Wei, Juan Ren and Zhuangde Jiang. Combined Effects of Pressure and Drain Current in the Piezoresistive Sensing of a MEMS Resonator. Proceeding of 17th Annual Conference of the Chinese Society of Micro-Nano Technology. 11 - 14 Oct 2015, Shanghai, China.

9.      Juan Ren, Mike Ward, Peter Kinnell, Martine Gear, Russell Cradock, The Experiment to Study the Behaviour of Microfabricated Silicon Diaphragms at 900°C, Microelectronic Engineering, Vol.87, pp.1213-1216, 2010. (SCI, EI,影响因子1.48)

10.   Juan Ren, Mike Ward, Peter Kinnell, Russell Cradock, Finite Element Modeling for Mechanical Behavior of Silicon Diaphragms Using Comsol Multiphysics, COMSOL CONFERENCE 2009, 14-16 Oct 2009, MILAN, ITALY

11.   Juan Ren, Mike Ward, Peter Kinnell, Russell Cradock, Mechanical behaviour of boron doped silicon diaphragms, 20th workshop on micromachining, micro mechanics and micro systems (MME09), 20-22 Sep 2009, LAAS-CNRS, Toulouse, France

12.   Juan Ren, David Cheneler, Mike Ward and Peter Kinnell,The Mechanical Behaviour of Silicon Diaphragms for Micromachined Capacitive Pressure Sensor, Advances in Science and Technology, Vol. 54, pp.422-427, 2008. (EI)


Technological Achievements

Honor Reward

Work experience

December 2013 to July 2016: Postdoctoral fellow, School of Mechanical Engineering, Xi'an Jiaotong University


July 2016 to present, Chang'an University